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  cystech electronics corp. spec. no. : c306a3 issued date : 2017.02.09 revised date : page no. : 1 / 8 bc560ca3 cystek product specification general purpose pnp epitaxial planar transistor bc560ca3 description ? the bc560ca3 is designed for use in driver stage of af amplifier and general purpose amplification. ? high h fe and excellent linearity ? pb-free and halogen-free package symbol outline bc560ca3 to-92 ordering information device package shipping BC560CA3-0-TB-G to-92 (pb-free lead plating and halogen-free package) 2000 pcs / tape & box bc560ca3-0-bk-g to-92 (pb-free lead plating and halogen-free package) 1000 pcs/ bag, 10 bags/box, 10boxes/carton b base c collector e emitte r c b e environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, tb :2000 pcs/tape & box; bk: 1000 pcs / bag, 10 bags/box, 10 boxes/carton product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c306a3 issued date : 2017.02.09 revised date : page no. : 2 / 8 bc560ca3 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo -60 v collector-emitter voltage v ceo -50 v emitter-base voltage v ebo -5 v collector current i c -150 ma peak collector current i cp -500 ma base current i b -20 ma power dissipation p d 625 mw thermal resistance, junction to ambient r ja 200 c/w operating junction temperature range tj -55~+150 c storage temperature range tstg -55~+150 c characteristics (ta=25c) symbol min. typ. max. unit test conditions bv cbo -60 - - v i c =-100 a bv ceo -50 - - v i c =-1ma bv ebo -5 - - v i c =-10 a i cbo - - -15 na v cb =-30v i ebo - - -15 na v eb =-4v *v ce(sat) - -0.071 -0.15 v i c =-10ma, i b =-0.5ma *v ce(sat) - -0.204 -0.35 v i c =-100ma, i b =-5ma *v be(sat) - -0.878 -1 v i c =-100ma, i b =-5ma v be(on) - -0.507 - v v ce =-5v, i c =-10 a v be(on) - -0.567 - v v ce =-5v, i c =-100 a v be(on) -0.55 -0.645 -0.7 v v ce =-5v, i c =-2ma h fe 100 593 - - v ce =-5v, i c =-10 a h fe 380 560 800 - v ce =-5v, i c =-2ma f t 100 - - mhz v ce =-6v, i c =-10ma cob - 2.63 6 pf v cb =-10v, f=1mhz *pulse test: pulse width 380 s, duty cycle 2%
cystech electronics corp. spec. no. : c306a3 issued date : 2017.02.09 revised date : page no. : 3 / 8 bc560ca3 cystek product specification typical characteristics emitter grounded output characteristics 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0123456 -vce, collector-to-emitter voltage(v) -ic, collector current(a) 200ua 300ua 400ua 500ua 1ma -ib=100ua emitter grounded output characteristics 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 -vce, collector-to-emitter voltage(v) -ic, collector current(a) 2.5ma 5ma -ib=500u a emitter grounded output characteristics 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0123456 -vce, collector-to-emitter voltage(v) -ic, collector current(a) 4ma 6ma 20ma -ib=2ma emitter grounded output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0123456 -vce, collector-to-emitter voltage(v) -ic, collector current(a) 10ma 15m a 25ma 50ma -ib=5ma current gain vs collector current 10 100 1000 1 10 100 1000 -ic, collector current(ma) hfe, current gai n 2 5 -40 125 - vce=1v current gain vs collector current 10 100 1000 1 10 100 1000 -ic, collector current(ma) hfe, current gain -40 25 125 - vce=2v
cystech electronics corp. spec. no. : c306a3 issued date : 2017.02.09 revised date : page no. : 4 / 8 bc560ca3 cystek product specification typical characteristics (cont.) current gain vs collector current 10 100 1000 1 10 100 1000 ic, collector current(ma) hfe, current gain -40 25 125 - vce=5v saturation voltage vs collector current 1 10 100 1000 1 10 100 1000 -ic, collector current(ma) -vce(sat), c-e saturation voltage (mv) 125c 25 -40c vce(sat)@ic=10i saturation voltage vs collector current 10 100 1000 10000 1 10 100 1000 -ic, collector current(ma) -vce(sat), c-e saturation voltage (mv) -40 25 125 vcesat@ic=20ib saturation voltage vs collector current 10 100 1000 10000 1 10 100 1000 -ic, collector current(ma) -vce(sat), c-e saturation voltage (mv) 2 5 -40 125 vcesat@ic=50ib saturation voltage vs collector current 10 100 1000 10000 1 10 100 1000 -ic, collector current(ma) -vce(sat), c-e saturation voltage(mv) vce(sat)@ic=100ib -40c 25c 125c saturation voltage vs collector current 100 1000 10000 1 10 100 1000 -ic, collector current(ma) -vbe(sat), b-e saturation voltage(mv) 1 25 25 vbe(sat)@ic=10ib -40c
cystech electronics corp. spec. no. : c306a3 issued date : 2017.02.09 revised date : page no. : 5 / 8 bc560ca3 cystek product specification typical characteristics (cont.) saturation voltage vs collector current 100 1000 1 10 100 1000 -ic, collector current(ma) -vbe(sat), b-e turn on voltage(mv) -vce=5v 125c 25c -40c power derating curves 0 100 200 300 400 500 600 700 800 0 25 50 75 100 125 150 175 ta, ambient temperature() pd, power dissipation(mw) cutoff frequency vs collector current 10 100 1000 0.1 1 10 100 -ic, collector current(ma) ft, cutoff frequency(mhz) vce=-12v capacitance vs reverse-biased voltage 1 10 100 0.1 1 10 100 -vr, reverse-biased voltage(v) capacitance(pf) cib cob
cystech electronics corp. spec. no. : c306a3 issued date : 2017.02.09 revised date : page no. : 6 / 8 bc560ca3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 d1 lead diameter h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255
cystech electronics corp. spec. no. : c306a3 issued date : 2017.02.09 revised date : page no. : 7 / 8 bc560ca3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 5 +1/-1 seconds 260 +0/-5 c recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. issued date : 2017.02.09 revised date : page no. : 8 / 8 spec. no. : c306a3 bc560ca3 cystek product specification to-92 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - * 0.1000 - * 2.54 c 0.5000 - 12.70 - i - * 0.0500 - * 1.27 d 0.0142 0.0220 0.36 0.56 1 - * 5 - * 5 e - * 0.0500 - * 1.27 2 - * 2 - * 2 f 0.1323 0.1480 3.36 3.76 3 - * 2 - * 2 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . bc560c marking: 3 1 a d b c i 1 e f 2 2 3 date code g h s t yle: pin 1.collector 2.base 3.emitter 3-lead t o -92 plastic package cy s t ek p a cka g e code: a 3


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